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China/Asia On Demand
Journal Articles
di wen chu li dui jk-2 tong he jin de biao mian ying du he ruan hua wen du de ying xiang
Pages: 120-122
Year: Issue:  1
Journal: Materials Science and Technology

Keyword:  低温热处理软化温度退火硬化;
Abstract: JK—2铜合金是一种新型的半导体集成电路和分立元件引线框架材料。同时也是一种良好的接插件弹性材料,软化温度是框架材料和弹性材料的重要指标,本文介绍了一种用低温热处理来提高JK—2铜合金软化温度的方法。
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