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Methods of Descending Effects of Via in High-speed PCB
Author(s): 
Pages: 57-60,72
Year: Issue:  4
Journal: Safety & EMC

Keyword:  信号完整性过孔阻抗突变电磁干扰PCB;
Abstract: 介绍了过孔的分类与应用,并针对盲孔的阻抗突变作用、通孔的EMI辐射问题,通过仿真方法分析得出:实际电路避开盲孔谐振点即可减弱阻抗突变作用;增加接地过孔,可改变电流的回流路径,减小电路的环路面积即可减弱EMI,并验证了此方法的优越性.
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